Hybrid Products
Hybrid/Partial hybrid PCB’s
Production since Y2002
Up to 18 Layers
Innovative & Cost effective
designs
Experience with various
material mix
Power Amplifier for RF
application
-
![]()
BP(Backplane)
-
![]()
LC(Line Card)
-
![]()
Server Products
-
![]()
ANT(Antenna)
-
![]()
HDI(Higth Density Interconnec)
-
![]()
Hybrid Products
-
![]()
Heat sinks(Metal-backed PCB)
-
![]()
Heavy Copper
苏公网安备32058302003707号